511-12M 数据手册 - Wakefield Engineering

散热片 High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm

2.50毫米（ .098 “ ）间距线对线插头外壳，可选面板安装， 4电路 2.50mm (.098") Pitch Wire-to-Wire Plug Housing, With Optional Panel Mount, 4 Circuits

2.50毫米（ .098 “ ）间距线对线插头外壳，带固定装置和可选PanelMount ， 4电路 2.50mm (.098") Pitch Wire-to-Wire Plug Housing, With Retainer and Optional PanelMount, 4 Circuits

2.50毫米（ .098 “ ）间距线对线插头外壳，可选面板安装， 9电路 2.50mm (.098") Pitch Wire-to-Wire Plug Housing, With Optional Panel Mount, 9 Circuits

2.50毫米（ .098 “ ）间距线对线插头外壳，可选面板安装， 2个电路 2.50mm (.098") Pitch Wire-to-Wire Plug Housing, With Optional Panel Mount, 2 Circuits

2.50毫米（ .098 “ ）间距线对线插头外壳，带固定装置和可选PanelMount ， 3电路 2.50mm (.098") Pitch Wire-to-Wire Plug Housing, With Retainer and Optional PanelMount, 3 Circuits

2.50毫米（ .098 “ ）间距线对线插头外壳，可选面板安装， 3电路 2.50mm (.098") Pitch Wire-to-Wire Plug Housing, With Optional Panel Mount, 3 Circuits