TSM4YL103KB25 数据手册 - Vishay Sfernice（思芬尼）

微调电位器, 10 kohm, 13 转, 表面安装设备, TSM4系列, 250 mW, ± 10%

VISHAY  TSM4YL103KR05  微调器,SMD 13转 10K

4mm 11 转密封 250mW TSM 4YL 系列小尺寸，具备最佳封装密度 专业等级 低接触电阻变化，稳定性出色 适用于手动和自动操作 完全密封，符合 IP67 汽相和回流焊接 在印迹剖面中提供Resistive Element | Cermet ---|--- Power Rating | 250mW at 85°C Limiting Element Voltage | 200V (linear law) Tolerance Standard | ±10% Temperature Coefficient | ±100ppm/°C Contact Resistance Variation | 1% or 3 ohms Electrical Travel | 11 turns ±2 Operating Torque | 1 Ncm max. Rotational Life (Electrical & Mechanical) | 100 cycles - rated power Soldering Temperature | Vapour phase 215°C/20 secs. Reflow: 230°C/20 secs.Do not exceed peak 260°C   |     |   Operating Temperature Range | -55°C to +125°C Dimensions | W. 5.0 D.5.0 H. 3.7mm ### 多转贴片电容器

4mm 11 转密封 250mW TSM 4YL 系列小尺寸，具备最佳封装密度 专业等级 低接触电阻变化，稳定性出色 适用于手动和自动操作 完全密封，符合 IP67 汽相和回流焊接 在印迹剖面中提供 Resistive Element | Cermet ---|--- Power Rating | 250mW at 85°C Limiting Element Voltage | 200V (linear law) Tolerance Standard | ±10% Temperature Coefficient | ±100ppm/°C Contact Resistance Variation | 1% or 3 ohms Electrical Travel | 11 turns ±2 Operating Torque | 1 Ncm max. Rotational Life (Electrical & Mechanical) | 100 cycles - rated power Soldering Temperature | Vapour phase 215°C/20 secs. Reflow: 230°C/20 secs.Do not exceed peak 260°C   |     |   Operating Temperature Range | -55°C to +125°C Dimensions | W. 5.0 D.5.0 H. 3.7mm ### 多转贴片电容器